TDA1558Q DATASHEET PDF

Dt Sheet. The device contains 4 x 11 W single-ended or 2 x 22 W BTL amplifiers and has been primarily developed for car radio applications. UNIT 6. SOT; August

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File under Integrated Circuits, IC May Philips Semiconductors. V P positive supply voltage. V PSC. I OSM. I ORM. P tot. T stg. AC and DC short-circuit safe voltage. R th vj-a. R th vj-c. There is no soldering method that is ideal for all IC.

Wave soldering is often preferred when. However, wave soldering is. In these. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in. Soldering by dipping or by wave. The maximum permissible temperature of the solder is. The total contact.

The device may be mounted up to the seating plane, but. If the. Repairing soldered joints. Apply a low voltage soldering iron less than 24 V to the. If the temperature of the. If the bit temperature is. Data sheet status. This data sheet contains preliminary data; supplementary data may be published later.

Limiting values. Stress above one or. These are stress ratings only and operation. Exposure to limiting values for extended periods may affect device reliability. Application information. These products are not designed for use in life support appliances, devices, or systems where malfunction of these. Philips customers using or selling these products for. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board.

However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature T stg max.

If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron less than 24 V to the lead s of the package, below the seating plane or not more than 2 mm above it.

Stress above one or more of the limiting values may cause permanent damage to the device. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. May 11 11 Page. Analog Devices.

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